קול קורא



Call for Paper – ChipEx2024

ChipEx2024 is the major annual event of the Israeli semiconductor industry.

ChipEx2024 invites any person or company involved with the semiconductor industry
to submit a paper addressing a specific problem or a case study related to the process of 
semiconductor design, development, implementation and manufacturing.
Submissions must be made via e-mail: info@chiportal.co.il by March 4, 2024 no later than 7:00pm Israel time. Authors of accepted papers will be invited to present their topic 
at the ChipEx2024 conference, scheduled for May 7, 2023 in Tel Aviv, Israel.

Topics of Interest

ChipEx2024 seeks papers addressing one of the following tracks:

• Silicon Solutions for the next digital generation

• Power Management & Signal Integrity

• Analog Design, RF and Sensors

• Physical Design and Manufacturability

• IP for SoC & NoC

• Verification, Simulation, Testing & Security

• Manufacturing, Packaging and Post Silicon processes

• Emerging and creative design technologies

• Users Track – sharing user experience with industry colleagues

The main theme of ChipEx2024 is Using AI to automate chip design and manufacturing tasks.

To make it easy for potential speaking applications, the ChipEx2024 steering committee has decided to introduce a series of key topics that are especially interesting for our audience.  Papers that will address these topics will be treated with higher priority.
 
Here are the key topics of ChipEx2024:

• AI/ML: Revolutionizing EDA and Verification
• The latest in HPC (High Performance Computing)
• How can quantum computing replace current technology nodes
• New capabilities achieved by Chiplet technologies
• Can ChatGPT shorten the design cycle?
• Advantages and disadvantages of 3D IC technologies
• How can RISC-V become alternative to x86 and Arm in HPC
• The impact of EDGE computing on the next generation of chip design
• Implementing Silicon Photonics in chip design
• VD FET and other innovative manufacturing technologies
• HW emulation and verification on the cloud
• Product Life Management, Automation and Monitoring
• Reliability, qualification and RMA (Return Material Authorization) procedures
• Heterogynous design in advanced nodes
• Adding analog design to advanced processors
• The impact of Multi Physics characteristics on timing signoff, power integrity and thermal reliability
• 3D & 4D Packaging, Heterogeneous Systems and other trends in advanced IC Packaging
• Designing processors for data centers and the cloud
• Can Chiplet technologies be used as IP for next generation processors?
• On-Chip security & new chip technologies that are resistant to cyber threats
• Integrated circuit design verification tools including Logic Verification
• New design & implementations for medical applications
• Future industry challenges after 3 and 1.8 nanometer
• Machine vision and image sensors based technologies
• Advanced sensors for IoT & Smart Cities applications
• SOC design for digital health & wearable applications
• What next after 5G?
• The latest in Lithography
• New trends in semiconductor manufacturing
•  How to improve yields in chip manufacturing
• Packaging – The critical role of advanced packaging in deep sub-micron technologies
• Reducing TTM (Time To Market) for System On Chip
• Using FPGA to address the needs of today's applications including 5G, Automotive, HPC, HMB and more
• Advantages and challenges of silicon photonics
• Generative AI in Chip, System, and Product Design
• Using AI to migrate from one nanotechnology to another
• The latest in RF and millimeter wave design
• Data security for Chip design
• How to ensure data security when using GenAI

Submission Process:
The following is the process for any paper submission.
1. The paper should only address one of the selected topics (see below a detailed list of interesting topics). 
 
2. Each paper must include an abstract of approximately 50 -100 words clearly stating the impact/result or significant contribution of the submitted topic.

3. The entire paper should not be longer than two pages (including the abstract)

4. The author must be ready to present the topic at ChipEx2024. The author or his/her representative will have 20 minutes to present the paper.

5. Presentations should not be biased or focused towards the author's company or business interests.

6. Papers which were previously published or simultaneously under review by another conference will be rejected, unless received special authorization by the organizers of ChipEx2024.

7. Authors of accepted papers must sign a "copyright release form".

Submissions not complying with these terms will be rejected.

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