קול קורא

Call for Paper – ChipEx2021

 

 

ChipEx2021 is the major annual event of the Israeli microelectronics industry.

 

ChipEx2021 invites any person or company involved with the microelectronics industry to submit a paper addressing a specific problem or a case study related to the process of microelectronics design, development, implementation and manufacturing.

 

Submissions must be made via e-mail: info@chiportal.co.il by April 5, 2021 no later than 7:00pm Israel time. Authors of accepted papers will be invited to present their topic at the ChipEx2021 conference, scheduled for June 21-22, 2021 in Tel Aviv, Israel.

 

Topics of Interest

 

ChipEx2021 seeks papers addressing one of the following tracks:

  • Silicon Solutions for the next digital generation
  • Power Management & Signal Integrity
  • Analog Design, RF and Sensors
  • Physical Design and Manufacturability
  • IP for SoC & NoC
  • Verification, Simulation, Testing & Security
  • Post Silicon and Reliability (including HW testing and packaging)
  • Emerging and creative design technologies
  • Users Track – sharing user experience with industry colleagues

The main theme of ChipEx2021 is Smart Technologies that will affect the Next Generation of Semiconductor Design.

 
To make it easy for potential speaking applications, the ChipEx2021 steering committee has decided to introduce a series of key topics that are especially interesting for our audience.

 

Papers that specifically address these topics will be treated with higher priority.

 

Here is the list of the ChipEx2021 key topics:

  • The role of AI & Virtual Reality in future chip design tools
  • The impact of Multi Physics characteristics on timing signoff, power integrity and thermal reliability
  • 3D Packaging, Heterogeneous system and other trends in advanced IC Packaging
  • AI/Ml - changing the future of semiconductor companies
  • The importance of HPC for processing next generation applications
  • The importance of Chiplet for the next generation of Processors
  • New designs addressing EDGE computing requirements
  • On-Chip Security & new chip technologies that are resistant to cyber threats
  • Integrated circuit design verification tools including Logic Verification
  • New design and implementations for medical applications
  • Future industry challenges after 5 and 3 nanometer
  • Quantum Computing
  • Machine vision and image sensors based technologies
  • Advanced devices for IoT & Smart Cities applications
  • SOC design for digital health & wearable applications
  • What next after 5G?
Submission Process
 

The following is the process for any paper submission.

  1. The paper should only address one of the selected topics (see below a detailed list of interesting topics).
  2. Each paper must include an abstract of approximately 50 -100 words clearly stating the impact/result or significant contribution of the submitted topic.
  3. The entire paper should not be longer than two pages (including the abstract).
  4. The author must be ready to present the topic at ChipEx2021. The author or his/her representative will have ~ 20 minutes to present the paper.
  5. Presentations should not be biased or focused towards the author's company or business interests.
  6. Papers which were previously published or simultaneously under review by another conference will be rejected, unless received special authorization by the organizers of ChipEx2021.
  7. Authors of accepted papers must sign a "copyright release form".

Submissions not complying with these terms will be rejected.

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